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AS/NZS 61439 vs IEC 61439 – Practical Guide for Low Voltage Assemblies

low voltage switchgear

Scope & Applicability

Both of standards cover low voltage switchgear and control gear assemblies. Key parts:
• 61439-1: General rules (definitions, ratings, verification framework)
• 61439-2: Power switchgear and controlgear assemblies (industrial/commercial boards)
• 61439-6:  Busbar trunking systems

Key Differences at a Glance

  • Alignments: AS/ NZS 61439 is harmonized with IEC 61439 but adds AU/ NZ context  ( installer rules via AS/ NZS 3000, RCM/ ACMA ) .
    • Evidence & Labels:  IEC evidence is usually acceptable if properly generated, but AU/NZ may require RCM,  local markings, and documentation mapping.
    • Responsibilities: Clearer definition of who is “manufacturer” (OEM vs assembler) and what must be kept as verification records.

 

Design Verification Methods

Three routes are allowed:
1) By testing — type tests on a representative assembly.
2) By comparison with a tested reference design — your design must be equal or more demanding.
3) By assessment — calculations/rules (e.g., temperature-rise, dielectric, short-circuit).

Routine Verification Checklist

Routine verification is done on every assembly before delivery. Typical items:  inspection of wiring and creepage/ clearance, mechanical operations, dielectric withstand, protection continuity, marking, and functions tests. Keep traceable records.

Short-Circuit Withstand (Icw / Icc / Conditional SCC)

Demonstrate withstand using Icw (short-time), Icp (no time), or Icc (conditional with upstream protective device). For conditional ratings, record the upstream device’s let-through and power-loss data; ensure the tested arrangement or valid substitution rules are met.

Temperature-Rise & Rated Diversity Factor (RDF)

Limits are given as Kelvin (ΔT) relative to ambient. If ambient is higher than the standard’s reference (typically 35–40 °C), apply correction. RDF=1 means test at full current; RDF<1 may need extra unit-level testing. Manage heating with proper busbar sizing, device loss data, spacing, and ventilation.

Figure: Illustrative Temperature-Rise correction example (ΔT). Values are for explanation only; always verify with device data and the applied standard.

Temperature-Rise & Rated Diversity Factor (RDF)

Creepage & Clearance

Clearance is line-of-sight air distance; creepage is along insulating surface. Distances depend on rated impulse voltage, pollution degree, and material group (CTI). Good layout avoids shorts and helps pass dielectric tests.

IP/IK Rating Selection

Choose IP for dust/water and IK for impact. Typical indoor panels: IP40–IP55. Harsh outdoor: IP54–IP66. IK10 is common for robust enclosures. Match to environment (washdown, dust, vandal risk).

Forms of Internal Separation (Form 1 / 3B / 4A / 4B)

Separation reduces exposure to live parts and helps limit arc faults.
• Form 1: no barriers (basic)
• Form 3B: busbars separated; functional units separated from busbars and from each other; terminals grouped
• Form 4A/4B: highest separation; terminals separated from functional units (and from each other in 4B)

EMC Immunity & Emissions

Industrial environments usually follow Class A emission limits. Keep VFDs/PSUs filtered and segregated. Evidence can be via component certificates and/or panel-level tests, stored in the verification pack.

Documentation & Marking

Provide a durable nameplate and a complete verification record: rated operational voltage (Ue), assembly current ratings (InA/InC), RDF, short-circuit ratings (Icw/Icp/Icc), IP/IK, and the applied parts of the standard (e.g., AS/NZS 61439-2). Include Supplier’s/Declaration of Conformity (SDoC) where required.

RCM vs CE Pathway (ANZ)

CE marking is for EU; RCM covers AU/NZ electrical safety/EMC (ACMA). For AU/NZ projects, map IEC evidence to local requirements and follow RCM labelling rules.

Can IEC Evidence Transfer to AS/NZS?

Often yes. Ensure original tests follow the correct edition/part, and create a clause mapping to AS/NZS. If devices are changed, verify power-loss and terminal temperature-rise are equal or lower than the tested setup, and that the cubicle size is not smaller.

Export Checklist EU → ANZ (Quick View)

  • Design verification evidence (test, comparison, assessment)
    • Routine verification records
    • EMC evidence (industrial immunity/emission limits)
    • Nameplate/marking to AS/NZS 61439-1/-2
    • RCM pathway and labelling plan
    • Installation notes referencing AS/NZS 3000 clearances and access

 

AS/NZS 3000 Clearances & Access

Plan working space, door swing, and front/rear access per local wiring rules. Keep operating handles within permitted height; document safe approach distances and maintenance access.

Manufacturer Responsibilities

Under 61439, the “manufacturer” (often the OEM) is responsible for design and verification. The assembler follows OEM instructions and performs routine tests. If you modify beyond the OEM scope, you take manufacturer responsibility.

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